JPH06833Y2 - 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム - Google Patents
透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ムInfo
- Publication number
- JPH06833Y2 JPH06833Y2 JP1986160173U JP16017386U JPH06833Y2 JP H06833 Y2 JPH06833 Y2 JP H06833Y2 JP 1986160173 U JP1986160173 U JP 1986160173U JP 16017386 U JP16017386 U JP 16017386U JP H06833 Y2 JPH06833 Y2 JP H06833Y2
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead frame
- semiconductor chip
- moisture
- transparent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 62
- 229920005989 resin Polymers 0.000 title claims description 22
- 239000011347 resin Substances 0.000 title claims description 22
- 230000003287 optical effect Effects 0.000 title claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 208000016021 phenotype Diseases 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986160173U JPH06833Y2 (ja) | 1986-10-21 | 1986-10-21 | 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986160173U JPH06833Y2 (ja) | 1986-10-21 | 1986-10-21 | 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367259U JPS6367259U (en]) | 1988-05-06 |
| JPH06833Y2 true JPH06833Y2 (ja) | 1994-01-05 |
Family
ID=31085307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986160173U Expired - Lifetime JPH06833Y2 (ja) | 1986-10-21 | 1986-10-21 | 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06833Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918591U (en]) * | 1972-05-19 | 1974-02-16 | ||
| JPS6136993Y2 (en]) * | 1978-06-30 | 1986-10-27 |
-
1986
- 1986-10-21 JP JP1986160173U patent/JPH06833Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6367259U (en]) | 1988-05-06 |
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